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It's a new day, so we have a new rumor for NVIDIA's next-gen AD102-powered GeForce RTX 4090 graphics card... which BTW, could be called the GeForce RTX 5090... more on that here.
Until now, NVIDIA's next-gen Ada Lovelace GPU would arrive with the flagship AD102-powered GeForce RTX 4090, and 24GB of GDDR6X memory at a faster 24Gbps. The 24GB of GDDR6X memory on the newly-released GeForce RTX 3090 Ti is closed at 21Gbps, for comparison.
But the new rumors state that the RTX 4090 would have the AD102-300 GPU, with 24GB of GDDR6X memory at a slower 21Gbps (so, the same bandwidth as the RTX 3090 Ti and its GDDR6X) but a much higher 600W of power consumption. This is up from the 450-500W of power that the custom RTX 3090 Ti models use, so it should be fun to see how far they can be pushed.
- Read more: NVIDIA could skip GeForce RTX 40 series, right into RTX 50 series GPUs
- Read more: NVIDIA GeForce RTX 4090/4080: 500-600W power is 'current expectation'
- Read more: NVIDIA's next-gen GeForce RTX 4090 rumored to use new GDDR7 memory
- Read more: NVIDIA GeForce RTX 4090 rumored with 'Infinity Cache' style cache
- Read more: NVIDIA's next-gen GeForce RTX 4090 could use up to an insane 850W+
- Read more: NVIDIA's next-gen GeForce RTX 4090: 4K gaming at insane 400FPS+ teased
In one of my FB Live streams, I discussed that NVIDIA is using these custom GeForce RTX 3090 Ti graphics cards as tests for their power-hungry next-gen Ada Lovelace GPUs. 600W+ of power with the same 24GB of GDDR6X at the same 21Gbps bandwidth... with a huge leap in performance with NVIDIA's new Ada Lovelace GPU architecture.
It will be interesting to see raw performance, as things are changing so quickly with the rumors -- but it seems we're finding some common ground with the 600W + 24GB + G6X + now 21Gbps for the GeForce RTX 4090/5090 graphics card.
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AMD's Ryzen 7 5800X3D, the world's first 3D V-Cache CPU, has been out for a while and it looks like the chip has been overclocked to 5.5 GHz.
AMD Ryzen 7 5800X3D 3D V-Cache CPU Overclocked To 5.5 GHz On ASUS X570 Motherboard
Spotted by TUM_APISAK, we have our first look at what seems to be a heavily overclocked AMD Ryzen 7 5800X3D CPU. We have already seen the same chip overclocked up to 5.15 GHz using an AM4 motherboard with an external clock generator but nowhere we have seen an overclock that's as impressive as this one.
The CPU-z screenshot shows that the AMD Ryzen 7 5800X3D CPU was successfully validated with an overclock of 5.5 GHz. The CPU's clock multiplier was adjusted to x55 which means that this is not a standard BCLK overclock. The chip was running just under 1.3V (1.296V) and while we don't know the exact cooling used, it was featured on an ASUS XROG Crosshair VIII DARK HERO motherboard & that's ASUS's top X570 offering. There are no benchmarks of performance results provided but we do know that the BIOS used is the 4201 which was released back in April of 2022.
So it is clearly no new BIOS that was involved in this test run. Now we have already seen AMD CPUs offer up to 5.85 GHz clock frequencies with the new Zen 4 core architecture but what's impressive about this 5.5 GHz clock is that it was done on the only 3D V-Cache chip that is available to users at the moment. Sure AMD is working on new Zen 4 V-Cache parts too but opening up Zen 3 V-Cache OC to users will breathe new life on the AM4 platform which is still the hot seller despite the launch of the latest Intel Core and AMD Ryzen CPUs. A few months ago, we reported that there was a BIOS in the works that might enable OC support on the 5800X3D:
However, it seems like there is a special overclocking BIOS that's been kept under wraps by AMD though we are hearing that this BIOS is expected to be released by certain board makers very soon. Whether or not this BIOS unchains forced locks imposed by AMD on overclocking is another question and just to be sure, overclocking the Ryzen 7 5800X3D will void its warranty since the CPU. I think the BIOS will come in handy for overclockers who want to break some records with the chip.
The CPU was never meant to be overclocked in the first place due to voltage limits but AMD did say that future iterations of 3D V-Cache will deliver better overclocking and clock capabilities. The AMD Ryzen 7 5800X3D performs neck-to-neck with the new Zen 4 core & bringing overclock capabilities to the platform will bring even faster CPU performance in gaming.
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Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In fact, Samsung has been playing with EUV-enabled DRAM fabrication process for a while and has already validated DDR4 memory with select partners.
To date, Samsung has produced and shipped a million of DDR4 DRAM modules based on chips made using the company’s D1x process technology that uses EUV lithography. These modules have completed customer evaluations, which proves that Samsung’s 1st Generation EUV DRAM technology enables to build fine circuits. Samsung’s D1x is an experimental EUVL fabrication process that was used to make experimental DDR4 DRAMs, though it will not be used any further, the company said.
Instead, to produce DDR5 and LPDDR5 next year, the company will use its D1a, a highly-advanced 14 nm-class process with EUV layers. This technology is expected to double per-wafer productivity (DRAM bit output) when compared to D1x technology, which indicates that it uses thinner geomtries. Samsung did not reveal whether its D1a also uses other innovations (in addition to EUVL), such as pillar cell capacitors and dual work function layers for buried wordline gates, as anticipated by analysts from TechInsights who believe that scaling DRAM cell transistors and capacitor structures offer limited capability to scale further from current levels.
Timeline of Samsung DRAM Milestones | ||
Date | Milestone | |
2021 | 4th-gen 10nm-class (1a) EUV-based 16Gb DDR5/LPDDR5 mass production | |
March 2020 | 4th-gen 10nm-class (1a) EUV-based DRAM development | |
September 2019 | 3rd-gen 10nm-class (1z) 8Gb DDR4 mass production | |
June 2019 | 2nd-gen 10nm-class (1y) 12Gb LPDDR5 mass production | |
March 2019 | 3rd-gen 10nm-class (1z) 8Gb DDR4 development | |
November 2017 | 2nd-gen 10nm-class (1y) 8Gb DDR4 mass production | |
September 2016 | 1st-gen 10nm-class (1x) 16Gb LPDDR4/4X mass production | |
February 2016 | 1st-gen 10nm-class (1x) 8Gb DDR4 mass production | |
October 2015 | 20nm (2z) 12Gb LPDDR4 mass production | |
December 2014 | 20nm (2z) 8Gb GDDR5 mass production | |
December 2014 | 20nm (2z) 8Gb LPDDR4 mass production | |
October 2014 | 20nm (2z) 8Gb DDR4 mass production | |
February 2014 | 20nm (2z) 4Gb DDR3 mass production | |
February 2014 | 20nm-class (2y) 8Gb LPDDR4 mass production | |
November 2013 | 20nm-class (2y) 6Gb LPDDR3 mass production | |
November 2012 | 20nm-class (2y) 4Gb DDR3 mass production | |
September 2011 | 20nm-class (2x) 2Gb DDR3 mass production | |
July 2010 | 30nm-class 2Gb DDR3 mass production | |
February 2010 | 40nm-class 4Gb DDR3 mass production | |
July 2009 | 40nm-class 2Gb DDR3 mass production |
Usage of EUVL will enable Samsung (and eventually other memory makers) to reduce (or eliminate) usage of multi patterning, which enhances patterning accuracy and therefore improves performance and yields. The latter will be beneficiary for production of high-performance high-capacity DDR5 chips as they are meant to increase both performance (up to DDR4-6400) and capacity (up to 32 Gbps). Samsung has not officially revealed how many EUV layers do its D1x and D1a process technologies use.
In addition to revealing its EUV-related achievements, Samsung also said that in the second half this year its P2 fab near Pyeongtaek, South Korea, will begin operations later this year. Initially, the facility will ‘make next-generation premium DRAMs’.
Jung-bae Lee, executive vice president of DRAM Product & Technology at Samsung Electronics, said the following:
"With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers. This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market."
Related Reading:
- Samsung Starts Mass Production at V1: A Dedicated EUV Fab for 7nm, 6nm, 5nm, 4nm, 3nm Nodes
- CES 2020: Micron Begins to Sample DDR5 RDIMMs with Server Partners
- Micron’s DRAM Update: More Capacity, Four More 10nm-Class Nodes, EUV, 64 GB DIMMs
- Keysight Reveals DDR5 Testing & Validation System
- SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM
- Cadence & Micron DDR5 Update: 16 Gb Chips on Track for 2019
- Cadence and Micron Demo DDR5-4400 IMC and Memory, Due in 2019
Source: Samsung
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In addition to its grand Ryzen 7000 "Zen 4" CPU launch, AMD has also given us a first look at their next-gen Radeon RX 7000 "RDNA 3" GPUs.
AMD Shows Off Next-Gen Radeon RX 7000 Series With RDNA 3 GPU Architecture
The teaser shown by AMD gives us a look at the graphics card which features the RDNA 3 GPU core. This could be one of the flagship designs of the lineup and it also seems to be slightly thicker than the current cards such as the RX 6950 XT. The shroud looks very similar to the reference design used by current cards and we can also see a hint of RGB illumination on the front of the card. The heatsink also features a unique red trim on 3 of the heatsink fins next to the dual 8-pin connectors which were reported a while back by Angstornomics.
Tonight we shared an early look at #RDNA3 running alongside the new @AMDRyzen 9 7950X. We can't wait to tell you more about our next generation Radeon graphics cards when we launch later this year.
Watch the "together we advance_PCs" event: https://t.co/DV2XOzItgbpic.twitter.com/UIPPiaMEFg
— Radeon RX (@Radeon) August 30, 2022
AMD showed a Radeon RX 7000 graphics card running on an AM5 platform with the top-of-the-line Ryzen 9 7950X CPU running Lies of P at a buttery smooth frame rate. The company didn't tell which card was used for this particular demo but it should be a high-end variant with an MCM design on a 5nm/6nm process node.
AMD confirmed that its RDNA 3 GPUs will be coming later this year with a huge performance uplift. The company's Senior Vice President of Engineering, Radeon Technologies Group, David Wang, said that the next-gen GPUs for Radeon RX 7000 series will offer over 50% performance per watt uplift vs the existing RDNA 2 GPUs. Some of the key features of the RDNA 3 GPUs highlighted by AMD will include:
- 5nm Process Node
- Advanced Chiplet Packaging
- Rearchitected Compute Unit
- Optimized Graphics Pipeline
- Next-Gen AMD Infinity Cache
- >50% Perf/Watt vs RDNA 2
In the information published by AMD, the company highlighted a few key features of its RDNA 3 GPUs that will power the next generation of Radeon RX graphics cards. The RDNA 3 GPU will be based on a 5nm process node and utilize an advanced chiplet packaging that delivers increased performance per watt. Furthermore, the GPU will house a range of new technologies such as a brand new and rearchitected Compute Unit, an optimized graphics pipeline, and the next-gen of Infinity Cache.
AMD Navi 31 "Plum Bonito" GPU Configuration
The AMD Navi 31 GPU, the flagship RDNA 3 chip, would power the next-gen enthusiast cards such as the Radeon RX 7900 XT graphics card. We have heard that AMD will drop CU (Compute Units) in favor of WGP (Work Group Processors) on its next-gen RDNA 3 GPUs. Each WGP will house dual CU (Compute Units) but with twice the SIMD32 clusters as opposed to just 2 on each CU within RDNA 2. Rumors are that AMD has the option to select between Samsung and TSMC for the 6nm die.
- AMD Navi 31: 12288 Cores, 384-bit Bus, 192 MB Infinity Cache, 308mm2 GPU Die @5nm
- AMD Navi 21: 5120 Cores, 384-bit Bus, 128 MB Infinity Cache, 520mm2 GPU Die @7nm
According to the latest information, the AMD Navi 31 GPU with RDNA 3 architecture is expected to offer a single GCD with 48 WGPs, 12 SAs, and 6 SEs. This will give out a total of 12,288 SPs or stream processors. This is an increase of 2.4x in cores compared to the 5120 SPs featured on the Navi 21 GPU. The GPU or the Navi 31 GCD is said to measure 308mm2 and will come packaged on TSMC's 5nm process node.
The Navi 31 GPU will also carry 6 MCD's which will feature 16 MB Infinity Cache per die and are also likely to carry the 64-bit (32-bit x 2) memory controllers that will provide the chip with a 384-bit bus interface. While this equals 96 MB of Infinity Cache which is lower than the 128 MB featured on the current Navi 21 GPUs, there's also a 3D-Stacked solution in the works which was pointed out recently and that would double the Infinity Cache with 32 MB (16 MB 0-hi + 16 MB 1-hi) capacities for a total of 192 MB of cache. This is a 50% increase versus the current Navi 21 design and it also makes Navi 31 the first GPU with both, chiplet and 3D stacked designs. These chiplets or MCD's will be fabricated on TSMC's 6nm process node and measure 37.5mm2 each.
The outlet reports that there was an even higher 288 MB (16 MB 0-Hi + 16 MB 1-Hi + 16 MB 2-Hi) MCD package planned but that was scrapped due to cost-benefit reasons. There are also talks of a cut-down variant of the Navi 31 GPU which will feature 42 WGPs or 10,752 cores and 5 MCDs for 80MB Infinity Cache across a 320-bit bus interface.
Now, this is going to result in higher power draw and AMD seems to have confirmed this much that their next-generation graphics card lineup will feature higher power consumption but they will still be a more efficient option than what NVIDIA has to offer. The AMD Radeon RX 6950 XT already has a TBP of 335W so for a >2x performance gain. The cards are expected to retain their dual 8-pin plug input for power and feature an updated triple-fan cooling design which is slightly taller than the one currently in use.
AMD Navi 32 "Wheat Nas" GPU Configuration
The AMD Navi 32 GPU codenamed "Wheat Nas" is also one of the two MCM GPUs featured in the RDNA 3 lineup. The GPU will feature a single GCD (Graphics Compute Dies) and four MCDs (Multi-Cache Die). The GPU or GCD is said to measure 200mm2 while each MCD will retain the same size at 37.5mm2.
- AMD Navi 32: 7680 Cores, 256-bit Bus, 64 MB Infinity Cache, 200mm2 GPU Die @5nm
- AMD Navi 22: 2560 Cores, 192-bit Bus, 96 MB Infinity Cache, 335mm2 GPU Die @7nm
The GCD will be equipped with 3 Shader Engines and each Shader Engine has 6 Shader Arrays (18 in total). The GPU will feature a total of 30 WGP or 60 Compute Units for a total of 7680 cores. This rounds up to >50% more cores than the Navi 31 flagship.
Each MCD should also feature 2 memory connect links (32-bit). That's a total of 8 32-bit memory controllers for a 256-bit bus interface. Each MCD will retain the 16 MB 0-Hi capacity but there does not seem to be any 1-Hi variant which means that the chip will have just 64 MB maximum configs. That Navi 32 GPU is said to launch in 2023 and will be the highest chip for mobile and mid-tier chip for desktops. The GPU would be first rolled out to the mobile segment and might be announced at CES 2023 which makes ideal sense since we will have Phoenix Range and Dragon Range laptops with Zen 4 cores ready by then.
AMD Navi 32 "Hotpink Bonefish" GPU Configuration
The AMD Navi 33 GPU codenamed "Hotpink Bonefish" will start the monolithic segment within the RDNA 3 family. The GPU will feature a single die. The die is very similar to the flagship Navi 21 GPU and is expected to utilize a 6nm process node for fabrication with a die size of 203mm2.
- AMD Navi 33: 4096 Cores, 128-bit Bus, 32 MB Infinity Cache, 335mm2 GPU Die @6nm
- AMD Navi 23: 2048 Cores, 128-bit Bus, 32 MB Infinity Cache, 237mm2 GPU Die @7nm
The Navi 33 GCD is expected to feature 2 Shader Engines and each Shader Engine has 2 Shader Arrays (2 per SE / 4 in total). This rounds up to 16 WGP's or 32 Compute Units for a total of 4096 cores which is higher than the Radeon RX 6800 "Navi 21 XL" GPU. The GPU will come packaged with 32 MB of Infinity Cache, the same amount as the Navi 23 GPU, and across a 128-bit wide bus. Just like the Navi 32 GPUs, the Navi 33 chips will be focused first on the mobile lineup with early graphics performance putting them ahead of the Intel Arc Alchemist lineup at less than half the cost & while pulling less power.
The AMD Radeon RX 7000 "RDNA 3" GPU lineup based on the Nav 3x GPUs is expected to launch later this year with reports pitting the flagship Navi 31 launch first followed by Navi 32 and Navi 33 GPUs.
AMD RDNA 3 Navi 3X GPU Configurations (Preliminary)
GPU Name | Navi 21 | Navi 33 | Navi 32 | Navi 31 | Navi 3X |
---|---|---|---|---|---|
Codename | Sienna Cichlid | Hotpink Bonefish | Wheat Nas | Plum Bonito | TBD |
GPU Process | 7nm | 6nm | 5nm/6nm | 5nm/6nm | 5nm/6nm |
GPU Package | Monolithic | Monolithic | MCM (1 GCD + 4 MCD) | MCM (1 GCD + 6 MCD) | MCM (TBD) |
GPU Die Size | 520mm2 | 203mm2 (Only GCD) | 200mm2 (Only GCD) 425mm2 (with MCDs) | 300mm2 (Only GCD) 522mm2 (with MCDs) | TBD |
Shader Engines | 4 | 2 | 3 | 6 | 8 |
GPU WGPs | 40 | 16 | 30 | 48 | 64 |
SPs Per WGP | 128 | 128 | 128 | 128 | 128 |
Compute Units (Per Die) | 80 | 32 | 60 | 96 | 128 (per GPU) 256 (Total) |
SPs (Per Die) | 5120 | 2048 | 3840 | 6144 | 4096 |
ALUs (Per Die) | 5120 | 4096 | 7680 | 12288 | 16384 |
Memory Bus | 256-bit | 128-bit | 256-bit | 384-bit | 384-bit x2? |
Memory Type | GDDR6 | GDDR6 | GDDR6 | GDDR6 | GDDR6 |
Memory Capacity | Up To 16 GB | Up To 8 GB | Up To 16 GB | Up To 24 GB | Up To 32 GB |
Memory Speed | 16-18 Gbps | TBD | TBD | 20 Gbps | TBD |
Memory Bandwidth | 512-576 GB/s | TBD | TBD | 960 GB/s | TBD |
Infinity Cache | 128 MB | 32 MB | 64 MB | 96/192 MB | TBD |
Flagship SKU | Radeon RX 6900 XTX | Radeon RX 7600 XT? Radeon RX 7700M? | Radeon RX 7800 XT? Radeon RX 7900M? | Radeon RX 7900 XTX | Radeon Pro |
TBP (Max) | 330W | ~150W | ~250W | 335W | TBD |
Launch | Q4 2020 | Q4 2022? | Q4 2022? | Q4 2022? | 2023? |
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AMD seems to have confirmed that they have their first Ryzen "Phoenix" CPUs with Xilinx's AI acceleration engines running in their labs.
AMD Confirms Xilinx's AI Engine-Powered Ryzen "Phoenix" CPUs Are Already Running In Their Labs
In a tweet by tech analyst David Schor, it is stated that AMD's President of Adaptive and Embedded Computing Group has confirmed during the AI Hardware Summit that they are already running their next-gen client Ryzen CPUs in their labs and feature Xilinx's AI acceleration engine. Since Ryzen was mentioned, we can point out that these are the upcoming Phoenix Point CPUs that were confirmed to feature an AI Engine back at AMD's Financial Analyst Day 2022. The tweet is provided below:
Some interesting updates: Victor Peng says Ryzen client chips with Xilinx's AI Engine are back from the fab and in the lab. #Ryzen#Xilinx
— David Schor (@david_schor) September 16, 2022
This also confirms that AMD has officially fabbed the Phoenix Point CPU and since it is running in their labs, it will be going through an intense validation process before hitting mass production in the coming year. AMD is expected to showcase its Phoenix Point CPUs for thin and light mobility PC platforms at CES 2023 and will utilize a brand new naming structure which was recently detailed by the company. The Phoenix Point APUs will be part of the AMD Ryzen 7000 family.
AMD Phoenix Point "Ryzen 7040" Series Mobility CPUs
AMD confirmed its Phoenix Point APU lineup which will utilize both Zen 4 and RDNA 3 cores. The new Phoenix APUs will carry LPDDR5 and PCIe 5 support and come in SKUs ranging from 35W to 45W. The lineup is also expected to launch in 2023 and most possibly at CES 2023. AMD has also pointed out that the laptop parts may include memory technologies aside from LPDDR5 and DDR5.
Based on earlier specs, it looks like the Phoenix Ryzen 7000 APUs might still carry up to 8 cores and 16 threads with higher core counts exclusive to Dragon Range chips. However, Phoenix APUs will carry a higher CU count for the RDNA 3 graphics core, uplifting the performance by a huge margin over anything that the competition might have to offer. The Phoenix Point APUs will also be AMD's first product to feature an AIE or AI Engine that will accelerate AI-specific tasks.
This engine will be based on IP developed by Xilinx which AMD acquired for $35 Billion US in 2020. The AIE will target Intel's own VPU "Versatile Processing Unit" which is also responsible for processing AI-based tasks and is expected to debut in 13th Gen Raptor Lake CPUs followed by a full-on integration in the 14th Gen Meteor Lake chips.
AMD Ryzen Mobility CPUs:
CPU Family Name | AMD Strix Point | AMD Dragon Range | AMD Phoenix | AMD Rembrandt | AMD Cezanne | AMD Renoir | AMD Picasso | AMD Raven Ridge |
---|---|---|---|---|---|---|---|---|
Family Branding | AMD Ryzen 8000 (H-Series) | AMD Ryzen 7045 (H-Series) | AMD Ryzen 7040 (U-Series) | AMD Ryzen 6000 AMD Ryzen 7030 | AMD Ryzen 5000 (H/U-Series) | AMD Ryzen 4000 (H/U-Series) | AMD Ryzen 3000 (H/U-Series) | AMD Ryzen 2000 (H/U-Series) |
Process Node | TBD | 5nm | 4nm | 6nm | 7nm | 7nm | 12nm | 14nm |
CPU Core Architecture | Zen 5 | Zen 4 | Zen 4 | Zen 3+ | Zen 3 | Zen 2 | Zen + | Zen 1 |
CPU Cores/Threads (Max) | TBD | 16/32 | 8/16 | 8/16 | 8/16 | 8/16 | 4/8 | 4/8 |
L2 Cache (Max) | TBD | 16 MB | 4 MB | 4 MB | 4 MB | 4 MB | 2 MB | 2 MB |
L3 Cache (Max) | TBD | 32 MB | 16 MB | 16 MB | 16 MB | 8 MB | 4 MB | 4 MB |
Max CPU Clocks | TBD | TBA | TBA | 5.0 GHz (Ryzen 9 6980HX) | 4.80 GHz (Ryzen 9 5980HX) | 4.3 GHz (Ryzen 9 4900HS) | 4.0 GHz (Ryzen 7 3750H) | 3.8 GHz (Ryzen 7 2800H) |
GPU Core Architecture | RDNA 3+ iGPU | RDNA 2 6nm iGPU | RDNA 3 5nm iGPU | RDNA 2 6nm iGPU | Vega Enhanced 7nm | Vega Enhanced 7nm | Vega 14nm | Vega 14nm |
Max GPU Cores | TBD | TBA | TBA | 12 CUs (786 cores) | 8 CUs (512 cores) | 8 CUs (512 cores) | 10 CUs (640 Cores) | 11 CUs (704 cores) |
Max GPU Clocks | TBD | TBA | TBA | 2400 MHz | 2100 MHz | 1750 MHz | 1400 MHz | 1300 MHz |
TDP (cTDP Down/Up) | TBD | 55W+ (65W cTDP) | 15W-45W (65W cTDP) | 15W-55W (65W cTDP) | 15W -54W(54W cTDP) | 15W-45W (65W cTDP) | 12-35W (35W cTDP) | 35W-45W (65W cTDP) |
Launch | 2024 | Q1 2023 | Q1 2023 | Q1 2022 | Q1 2021 | Q2 2020 | Q1 2019 | Q4 2018 |
- NVIDIA Spends Big Money To Acquire TSMCs 5nm Wafers For Next-Gen GeForce RTX 40 Ada Lovelace GPUs - Wccftech
- AMDs 12-Core Ryzen 9 7845HX Dragon Range High-End Laptop CPU Shows Up In AOTS Benchmark - Wccftech
- AMD Officially Confirms 4th Gen EPYC Genoa Zen 4 CPU Unveil on 10th November - Wccftech
- Spectacular AMD Navi 31 RDNA 3 MCM specs indicate 15360 SPs ... - Notebookcheck.net